Embedded World 2025 Day 1: What You Need To Know
Day 1 of Embedded World 2025 kicked off with a clear focus on the evolving security landscape for connected devices and the need to explore practical approaches to implementing security from manufacturing through deployment. From EPS Global’s dedication to securing embedded product manufacturing to SCI Semiconductor‘s breakthrough technologies, here’s a detailed look at the highlights from Day 1.
EPS Global: Securing the Future of Embedded Systems
We have a team at Embedded World 2025 and every day at 1 pm., Malcolm Kitchen from EPS Global, FAE specializing in Embedded Trust for the IoT, is presenting our robust and proven solutions to secure microcontroller-based systems using IAR’s Embedded Security with EPS Global’s provisioning services.
With embedded systems being at the heart of critical infrastructure, ensuring products are “digital safe” throughout the manufacturing process and in the field is more relevant than ever.
SCI Semiconductor: A Leap Forward in Memory Safety
At the SCI Semiconductor booth, Haydn Povey introduced their innovative CHERI and CHERIOT technologies. These advancements are driving the next generation of ICENI devices, which are designed to address the growing concern of memory safety in embedded systems, particularly in regulated industries and critical infrastructure.
Malcolm: Haydn, what can you tell us about your plans for Embedded World this year?
Haydn Povey: We’re really proud to have our first booth at Embedded World this year, where we’re demonstrating our CHERI and CHERIOT technologies. These underpin our new ICENI devices, and we’re particularly excited about their role in critical infrastructure, where security is paramount.
As Haydn explained, memory safety is responsible for about 70% of the critical vulnerabilities and exploits found in embedded systems. This is particularly evident in industrial automation and software supply chain issues, which can account for as much as 90% of CVEs (Common Vulnerabilities and Exposures) in designs. With these alarming statistics in mind, SCI Semiconductor is pushing to resolve these security issues with their advanced technology.
Malcolm: That’s a huge issue in the industry. How does your technology help address this?
Haydn Povey: The CHERI and CHERIOT technologies help to stop memory safety issues in their tracks by implementing hardware-level safety measures. Our ICENI devices include capability-enhanced risk instructions and compartmentalization that limits the ‘blast radius’ of any attack. This means even if there’s a failure in the software supply chain, it can’t escalate or create additional attack vectors. We’re basically making it impossible for attackers to take control.
This cutting-edge compartmentalization reduces the potential impact of any security breaches and ensures a higher level of resilience against cyber threats, especially in sensitive sectors where security is non-negotiable.
Demos and Live Showcases
SCI Semiconductor is offering live demonstrations of their technology throughout the event. The demo provides an excellent opportunity for attendees to experience firsthand the powerful innovations in memory safety and digital security that are shaping the future of embedded systems.
Stay tuned for more updates as Embedded World 2025 continues to unfold, and our roving reporter Malcolm brings us more exciting updates from our partners’ booths at NXP Semiconductors, IAR, Future Electronics, STMicroelectronics and more!
