Frequently Asked Questions

Tape and reel packaging is the process of inserting electronic or mechanical components into individual pockets of carrier tape, sealing them with pressure or heat-activated cover tape, and winding the sealed tape onto an industry-standard reel. The reels are then loaded directly onto pick-and-place machines for automated component placement during PCB assembly or product manufacturing. This method complies with EIA-481 and JEDEC standards, and carrier tape is available in widths from 8mm to 88mm to accommodate components of virtually any size — from 0101 (1mm) packages up to large connectors and electromechanical parts.

A wide range of components can be tape and reeled, including surface mount devices (SMDs), through-hole components, transistors, diodes, MOSFETs, connectors, electromechanical parts, sensors, heat sinks, and custom mechanical components. EPS Global’s tape and reel service supports packaging for ICs, passives, BGAs, QFPs, QFNs, SOICs, TSSOs, axial and radial components, and non-standard parts using custom carrier tape. Components can be received in trays, tubes, or bulk packaging and converted to tape and reel format.

Cut tape delivers components in short, individual strips of tape, while tape and reel provides a long, continuous tape wound onto a reel. Tape and reel is generally preferred for production because it only requires a single feeder load per reel, reducing operator interventions and machine downtime. Cut tape can sometimes jam in feeders and requires quality control notification each time new strips are loaded. However, cut tape is appropriate when only a small quantity of a specific component is needed, such as for prototype assembly.

Manual tape and reel packaging involves operators placing components by hand into carrier tape. It is lower cost, more flexible for non-standard component sizes, and has reduced risk of equipment downtime. However, it is slower, less consistent, and more prone to human error. Automated tape and reel packaging uses machines with vision-controlled placement, automated optical inspection (AOI), and consistent sealing. It offers higher throughput, greater uniformity, better quality detection, and faster turnaround, but requires higher capital investment and carries risk of equipment downtime. Most high-volume production environments use automated systems.

Custom carrier tape is tape specifically designed and manufactured to fit components that do not match standard embossed pocket dimensions. This is common for unusually shaped parts such as large connectors, transformers, sensors, heat sinks, and non-standard mechanical components. Custom tape is produced by thermoforming or machining pockets to the exact dimensions of the component. EPS Global designs and manufactures custom carrier tape in-house, with tape widths ranging from 8mm to 88mm and pocket depths up to 20mm or more, enabling tape and reel packaging for virtually any component geometry.

Yes. Tape and reel packaging has expanded well beyond traditional electronic components. Mechanical components such as metal stampings, pins, connectors, heat sinks, fasteners, springs, and sensors can all be tape and reeled using custom carrier tape and bowl-fed automated handling systems. This allows manufacturers in industries including automotive, medical devices, industrial manufacturing, and consumer products to automate the placement of parts that were previously inserted manually, significantly improving production efficiency.

Standard tape and reel packaging projects are typically completed within 3 to 4 business days. EPS Global also offers expedited turnaround options for same-day and next-day service when production schedules demand faster delivery. Turnaround time can vary depending on volume, component complexity, and whether custom carrier tape needs to be manufactured. Contact us for a quote.

Yes. Tape and reel packaging can significantly reduce production costs by enabling automated pick-and-place assembly instead of manual component insertion. Specific cost benefits include faster machine setup times (loading one reel versus multiple trays or tubes), higher throughput from continuous feeding, reduced labor requirements, lower scrappage from consistent automated handling, and potential reduction in the number of production shifts or SMT machines required. In some cases, converting tray-fed components to tape and reel has eliminated the need for large manual assembly teams at end-of-line stations.

Wafer taping is the process of picking individual semiconductor die from expanded wafers (mounted on blue tape loop rings), optically inspecting them, and placing them into carrier tape for automated assembly. This service handles 6-inch and 8-inch standard wafers with die sizes as small as 0.5mm × 0.5mm. Advanced automated optical inspection (AOI) detects defects including surface contamination, geometric irregularities, edge chipping, and structural defects. Wafer taping at EPS Global is performed in ISO 14644-1 certified cleanroom environments to prevent contamination of sensitive semiconductor components.

IC programming (also called programming-as-a-service) is the outsourced programming of integrated circuits — including microcontrollers, memory devices, CPLDs, UFS, and eMMC — before they are placed onto a PCB. A programming house loads the required firmware onto blank components using automated equipment, then delivers them ready for assembly. This removes the programming step from in-circuit testing (ICT), reducing test time and eliminating production bottlenecks. Services typically include serialization, custom laser marking, 3D coplanarity inspection, encrypted key loading, and support for any input/output packaging combination (tray to tray, tray to tape, tape to tape, etc.).

Outsourcing IC programming removes a significant bottleneck from the production line. In-circuit testing (ICT) with programming can take over 10 seconds per device, and at high volumes this may require multiple testers — each costing approximately one million dollars — plus custom test fixtures for every board variant. By pre-programming components offline, the board arrives at ICT with firmware already embedded, reducing test algorithm time and increasing line throughput. Outsourcing also eliminates the need to manage programming equipment, adapters, software revisions, and specialist staff internally, allowing manufacturers to focus on their core assembly operations. EPS Global operates 23 programming centers worldwide.

UFS (Universal Flash Storage) and eMMC (embedded Multi-Media Card) programming involves loading firmware and data onto high-capacity flash storage devices used primarily in automotive, mobile, and consumer electronics applications. These devices support multi-gigabyte and terabyte storage capacities and are used in Advanced Driver Assistance Systems (ADAS), navigation systems, and integrated infotainment platforms. Programming these devices requires specialized equipment capable of handling long cycle times and large data volumes at production scale. Learn more about EPS Global’s IC programming capabilities.

EPS Global uses a purpose-built ERP system designed specifically around component programming and preparation. When a firmware engineering change notice (ECN) is issued, the system ensures the correct revision is reflected globally across all programming centers. Consigned customer inventory is managed so that version changes do not hold up production. Each blank component receives a new part number after programming, and full traceability is maintained through automated log files that record programming verification, optical inspection results, and laser marking for every device processed.

Embedded security provisioning is the process of injecting cryptographic keys, certificates, and secure firmware into microcontrollers and other programmable devices during the IC programming stage — before components reach the assembly line. This ensures each device has a unique, authenticated identity from the point of manufacture, protecting against counterfeiting, cloning, and unauthorized firmware modification. EPS Global works with leading security ecosystem partners including NXP, IAR, Microchip, and others to deliver turnkey provisioning through its ESecIP (Embedded Secure IP) platform.

Component baking is a controlled heating process that removes absorbed moisture from electronic components before they undergo reflow soldering during PCB assembly. All integrated circuits are subject to moisture ingress when exposed to ambient conditions. During reflow, temperatures reach approximately 220–250°C (430–480°F), causing any trapped moisture to rapidly convert to steam. This can cause internal delamination, cracking, or package rupture — an effect known as “popcorning” — which may not always be visible and can lead to latent field failures. Baking in software-controlled ovens at specified temperatures and durations per J-STD-033 and JEDEC standards safely evaporates the moisture before assembly.

Components need baking when their moisture barrier packaging has been opened and the floor life exposure time has been exceeded, when they have been stored beyond their 24-month date code, when sourced from alternative or non-traditional distributors where storage conditions are uncertain, or when humidity indicator cards inside the packaging show saturation. The required baking time and temperature depend on the component’s Moisture Sensitivity Level (MSL 1 through 5a) and package thickness, as defined in J-STD-033. After baking, components should be properly dry-bagged with desiccant and humidity indicators.

Popcorning is a defect that occurs during reflow soldering when moisture trapped inside an electronic component rapidly expands into steam due to the high temperatures involved (up to 250°C). The rapid expansion can crack the component’s internal structure, cause package delamination, or rupture the IC entirely. The term comes from the similarity to how moisture in a kernel of corn causes it to pop. Popcorning is particularly dangerous because the damage is not always externally visible and may only manifest as a field failure after the product has been deployed. It is prevented by ensuring components are properly stored in moisture barrier packaging or baked before assembly.

Moisture Sensitivity Levels (MSL) are classifications defined by IPC/JEDEC standard J-STD-020 that indicate how sensitive a component is to moisture absorption and how long it can be exposed to ambient conditions after removal from its moisture barrier bag before it must be baked or soldered. MSL ratings range from MSL 1 (unlimited floor life, not moisture sensitive) to MSL 5a and 6 (extremely sensitive, requiring baking before use and very short floor life). The MSL rating determines the required baking time, temperature, and storage conditions for each component.

Yes. If your components are already on reels, EPS Global can de-reel them using automated handlers, place them in trays for the baking process, and then tape and reel them again once complete. Components are returned in your preferred packaging format — on reels, in trays, or dry-bagged — with moisture barrier bags, desiccant, and humidity indicators included. If reprogramming is also required, this can be done as part of the same process.

Component preforming is the process of mechanically shaping the leads of through-hole electronic components to match the required mounting configuration for a specific PCB layout. This includes operations such as de-bandoliering (removing components from bandolier tape), lead cropping to the correct length, lead bending or forming to specified dimensions, and polarity testing to verify correct orientation. Preformed components can then be tape and reeled for automated insertion, improving production line efficiency compared to manual placement.

Component kitting is the process of gathering, organizing, and packaging all of the individual electronic components required for a specific assembly job into a single kit. Rather than sourcing and managing each component separately on the production floor, a kitting service delivers a complete, ready-to-use package matched to a particular bill of materials (BOM). This reduces inventory management overhead, minimizes line-side errors, and streamlines the handoff between component preparation and PCB assembly. Contact EPS Global to discuss kitting for your project.

3D coplanarity inspection is an automated quality check that measures whether all leads or solder balls on an integrated circuit are within the same plane, ensuring they will make proper contact with the PCB during soldering. As IC packaging has miniaturized, even microscopic deviations in lead height can cause open solder joints or placement failures. EPS Global performs in-line 3D coplanarity inspection on all programmed devices to detect any handling or manufacturing damage before components are shipped to the customer.

Yes. EPS Global’s cable assembly service covers single-wire and multi-wire cable production including cutting, stripping, tinning, soldering of connectors (jack, RCA, plastic), partial insulation stripping, heat shrink tube application, cable shielding, and sensor or switch soldering. Capabilities include wire gauges down to 32 AWG, minimum wire lengths of 15mm, and stripping lengths from 1–10mm. These services are available alongside IC programming and tape and reel at select EPS Global service centers.

The primary standard governing tape and reel packaging is EIA-481, which specifies carrier tape dimensions, reel sizes, component orientation, cover tape requirements, and labeling. JEDEC standards cover semiconductor-specific packaging requirements. Additional relevant standards include EIA-556 and EIA-624 for labeling and reel specifications. Carrier tape and reels must also meet ESD (electrostatic discharge) protection requirements, with options for conductive, dissipative, or non-conductive tape depending on component sensitivity.

Electrostatic discharge (ESD) protection is critical during tape and reel packaging because many electronic components can be damaged or degraded by static electricity. Proper precautions include using anti-static or static-dissipative carrier tape materials, maintaining ESD-safe work environments with controlled humidity and grounding, and ensuring all personnel and equipment are properly grounded. Carrier tape options include conductive tape (allows current to pass through), dissipative tape (prevents electrostatic discharge buildup), and non-conductive tape (insulating, for components that are not ESD-sensitive).

A reputable component packaging and programming provider should hold ISO 9001 certification for quality management systems as a minimum. For automotive applications, VDA 6.3 process audit compliance is essential. Additional certifications that demonstrate operational maturity include ISO 14001 for environmental management and ISO 27001 for information security management. The provider should also demonstrate compliance with EIA-481 and JEDEC standards for tape and reel packaging, J-STD-033 for moisture-sensitive device handling, and maintain controlled ESD environments throughout all facilities. View EPS Global’s certifications.

Key factors when selecting a tape and reel packaging vendor include: experience and track record (look for vendors with decades of specialization and hundreds of millions of components processed); quality certifications (ISO 9001, and VDA 6.3 for automotive applications); inspection capabilities (2D and 3D automated optical inspection, coplanarity checking); ESD handling protocols and controlled environments; range of carrier tape inventory and custom tape manufacturing capability; turnaround time and expedited service options; geographic proximity to your manufacturing location to reduce freight costs and lead times; and the availability of complementary services such as IC programming, component baking, and kitting to consolidate your supply chain.

EPS Global operates 23 service centers worldwide, strategically located close to major electronics manufacturing clusters. Locations span across Ireland, Romania, Czech Republic, Hungary, the United States, Mexico, Brazil, Malaysia, India, Thailand, and China. This global footprint allows EPS Global to provide local support, reduce freight costs, and ensure on-time delivery aligned with customers’ production schedules. All centers offer IC programming and tape and reel services, with additional capabilities varying by location. Find your nearest center.