Semiconductor Wafer
Taping and Packaging
Transform your semiconductor production with our advanced wafer handling and packaging systems. Our state-of-the-art technology ensures precise die transfer and placement for your most demanding applications, supporting miniature component/die sizes down to 0.5mm x 0.5mm.
EPS Global offers Wafer Tape and Reel Services with Automated Optical Inspection
Wafer Taping and AOI
Our advanced Wafer Taping service ensures precise handling of your semiconductor components with compatibility for both 6″ and 8″ standard wafers using industry-standard blue tape. Paired with our comprehensive Automated Optical Inspection (AOI) system, we deliver superior accuracy and reliability while maintaining the highest quality standards for your semiconductor production needs.
Our Wafer Taping and Inspection Process
ISO 14644-1 Cleanroom Standards
Our state-of-the-art cleanroom facilities meet rigorous ISO Class standards, providing the controlled environment essential for wafer taping operations. With advanced contamination control systems and strict protocols, we maintain optimal conditions for handling sensitive semiconductor components, ensuring your products meet the highest quality and reliability standards.
| Class | Maximum Particles/m³ | FED STD 209E | |||||
|---|---|---|---|---|---|---|---|
| >=0.1 µm | >=0.2 µm | >=0.3 µm | >=0.5 µm | >=1 µm | >=5 µm | ||
| ISO 1 | 10 | 2 | |||||
| ISO 2 | 100 | 24 | 10 | 4 | |||
| ISO 3 | 1,000 | 237 | 102 | 35 | 8 | Class 1 | |
| ISO 4 | 10,000 | 2,370 | 1,020 | 352 | 83 | Class 10 | |
| ISO 5 | 100,000 | 23,700 | 10,200 | 3,520 | 832 | 29 | Class 100 |
| ISO 6 | 1,000,000 | 237,000 | 102,000 | 35,200 | 8,320 | 293 | Class 1,000 |
| ISO 7 | 352,000 | 83,200 | 2,930 | Class 10,000 | |||
| ISO 8 | 3,520,000 | 832,000 | 29,300 | Class 100,000 | |||
| ISO 9 | 35,200,000 | 8,320,000 | 293,000 | Room Air | |||
Quality Control
Our advanced inspection systems detect and categorize component defects with precision accuracy, from microscopic surface anomalies to structural imperfections. Through comprehensive visual and automated inspection processes, we ensure only components meeting stringent quality standards proceed to packaging, maintaining the highest level of reliability for your semiconductor products.
Types of Defects We Detect:
What our
Customers Say
From personal experience – these guys do a great job! I emailed them for help on a project this morning and had a fifteen minute answer.
We were looking to tape & reel metal heatsinks, and Diehl Controls introduced us to EPS. They have provided good service, and good support in project development. They also offered a great logistics solution for the material transportation.
Contact EPS
Email programming@epsglobal.com or,
Complete the form below and a local Programming Manager will get back to you immediately.
