Bowl-Fed Packaging Solutions | Delivering Line-Ready Product in Production Volumes

Our clients often have non-standard requirements during the manufacturing process, such as the packaging of extremely high volumes of non-electronic devices used in the SMT process. With a deep understanding of component configuration and pre-forming, our skilled team of electrical engineers have designed and manufactured bowl-fed packaging solutions.

Using our vibrating bowl feeding technology enables us to repackage small components on reels ready for surface mounting. Additionally we use our bowl feeders to singulate leaded components during the pre-forming process and many other specialized processes such as polarity testing prior to lead cropping. Manual handling is eliminated, increasing speed and accuracy, and reducing points of failure.