High-Speed Die Sorting: AOI Inspection & Tape Packaging

A quick look at the automated “pick, inspect, and place” process at our R&D facility in Brno.

In this short clip, you’ll see a turret system equipped with 16 pick-up heads rapidly sorting wafer dies. Each die undergoes an Automated Optical Inspection (AOI) to check for defects before being precisely placed into a carrier tape. The final step involves sealing the tape, securing the components for the next stage of assembly.

This is a critical step that guarantees the quality and reliability of electronic components.